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an important notice at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. production data. uln2002a , uln2003a , uln2003ai ulq2003a , uln2004a , ulq2004a slrs027o ? december 1976 ? revised january 2016 uln200x, ulq200x high-voltage, high-current darlington transistor arrays 1 1 features 1 ? 500-ma-rated collector current (single output) ? high-voltage outputs: 50 v ? output clamp diodes ? inputs compatible with various types of logic ? relay-driver applications 2 applications ? relay drivers ? stepper and dc brushed motor drivers ? lamp drivers ? display drivers (led and gas discharge) ? line drivers ? logic buffers 3 description the ulx200xa devices are high-voltage, high-current darlington transistor arrays. each consists of seven npn darlington pairs that feature high-voltage outputs with common-cathode clamp diodes for switching inductive loads. the collector-current rating of a single darlington pair is 500 ma. the darlington pairs can be paralleled for higher current capability. applications include relay drivers, hammer drivers, lamp drivers, display drivers (led and gas discharge), line drivers, and logic buffers. for 100-v (otherwise interchangeable) versions of the ulx2003a devices, see the slrs023 data sheet for the sn75468 and sn75469 devices. the uln2002a device is designed specifically for use with 14-v to 25-v pmos devices. each input of this device has a zener diode and resistor in series to control the input current to a safe limit. the ulx2003a devices have a 2.7-k ? series base resistor for each darlington pair for operation directly with ttl or 5-v cmos devices. the ulx2004a devices have a 10.5-k ? series base resistor to allow operation directly from cmos devices that use supply voltages of 6 v to 15 v. the required input current of the ulx2004a device is below that of the ulx2003a devices, and the required voltage is less than that required by the uln2002a device. . device information (1) part number package body size (nom) ulx200xd soic (16) 9.90 mm 3.91 mm ulx200xn pdip (16) 19.30 mm 6.35 mm uln200xns sop (16) 10.30 mm 5.30 mm uln200xpw tssop (16) 5.00 mm 4.40 mm (1) for all available packages, see the orderable addendum at the end of the data sheet. . . simplified block diagram productfolder 7c 6c 5c 4c 3c 2c 1c com 7 6 5 4 3 2 1 7b 6b 5b 4b 3b 2b 1b 10 11 12 13 14 15 16 9 support &community tools & software technical documents sample &buy
2 uln2002a , uln2003a , uln2003ai ulq2003a , uln2004a , ulq2004a slrs027o ? december 1976 ? revised january 2016 www.ti.com product folder links: uln2002a uln2003a uln2003ai ulq2003a uln2004a ulq2004a submit documentation feedback copyright ? 1976 ? 2016, texas instruments incorporated table of contents 1 features .................................................................. 1 2 applications ........................................................... 1 3 description ............................................................. 1 4 revision history ..................................................... 2 5 pin configuration and functions ......................... 3 6 specifications ......................................................... 4 6.1 absolute maximum ratings ...................................... 4 6.2 esd ratings .............................................................. 4 6.3 recommended operating conditions ....................... 4 6.4 thermal information .................................................. 4 6.5 electrical characteristics: uln2002a ....................... 5 6.6 electrical characteristics: uln2003a and uln2004a .................................................................. 5 6.7 electrical characteristics: uln2003ai ...................... 6 6.8 electrical characteristics: uln2003ai ..................... 6 6.9 electrical characteristics: ulq2003a and ulq2004a ................................................................. 7 6.10 switching characteristics: uln2002a, uln2003a, uln2004a .................................................................. 7 6.11 switching characteristics: uln2003ai .................. 7 6.12 switching characteristics: uln2003ai .................. 8 6.13 switching characteristics: ulq2003a, ulq2004a 8 6.14 typical characteristics ............................................ 8 7 parameter measurement information ................ 10 8 detailed description ............................................ 12 8.1 overview ................................................................. 12 8.2 functional block diagrams ..................................... 12 8.3 feature description ................................................. 13 8.4 device functional modes ........................................ 13 9 application and implementation ........................ 14 9.1 application information ............................................ 14 9.2 typical application ................................................. 14 9.3 system examples ................................................... 17 10 power supply recommendations ..................... 18 11 layout ................................................................... 18 11.1 layout guidelines ................................................. 18 11.2 layout example .................................................... 18 12 device and documentation support ................. 19 12.1 documentation support ........................................ 19 12.2 related links ........................................................ 19 12.3 community resources .......................................... 19 12.4 trademarks ........................................................... 19 12.5 electrostatic discharge caution ............................ 19 12.6 glossary ................................................................ 19 13 mechanical, packaging, and orderable information ........................................................... 19 4 revision history note: page numbers for previous revisions may differ from page numbers in the current version. changes from revision n (june 2015) to revision o page ? changed pin functions table to correct typographical error. ................................................................................................ 3 changes from revision m (february 2013) to revision n page ? added pin configuration and functions section, esd ratings table, feature description section, device functional modes , application and implementation section, power supply recommendations section, layout section, device and documentation support section, and mechanical, packaging, and orderable information section .............................. 1 ? deleted ordering information table. no specification changes. ............................................................................................. 1 ? moved typical characteristics into specifications section. ................................................................................................... 8 changes from revision l (april 2012) to revision m page ? updated temperature rating for uln2003ai in the ordering information table ........................................................ 1 changes from revision k (august 2011) to revision l page ? removed reference to obsolete uln2001 device .................................................................................................................. 1
3 uln2002a , uln2003a , uln2003ai ulq2003a , uln2004a , ulq2004a www.ti.com slrs027o ? december 1976 ? revised january 2016 product folder links: uln2002a uln2003a uln2003ai ulq2003a uln2004a ulq2004a submit documentation feedback copyright ? 1976 ? 2016, texas instruments incorporated (1) i = input, o = output 5 pin configuration and functions d, n, ns, and pw package 16-pin soic, pdip, so, and tssop top view pin functions pin i/o (1) description name no. 1b 1 i channel 1 through 7 darlington base input 2b 2 3b 3 4b 4 5b 5 6b 6 7b 7 1c 16 o channel 1 through 7 darlington collector output 2c 15 3c 14 4c 13 5c 12 6c 11 7c 10 com 9 ? common cathode node for flyback diodes (required for inductive loads) e 8 ? common emitter shared by all channels (typically tied to ground) 1b 1 16 2b 2 15 3b 3 14 4b 4 13 5b 5 12 6b 6 11 7b 7 10 e 8 9 1c2c 3c 4c 5c 6c 7c com
4 uln2002a , uln2003a , uln2003ai ulq2003a , uln2004a , ulq2004a slrs027o ? december 1976 ? revised january 2016 www.ti.com product folder links: uln2002a uln2003a uln2003ai ulq2003a uln2004a ulq2004a submit documentation feedback copyright ? 1976 ? 2016, texas instruments incorporated (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) all voltage values are with respect to the emitter/substrate terminal e, unless otherwise noted. 6 specifications 6.1 absolute maximum ratings at 25 c free-air temperature (unless otherwise noted) (1) min max unit v cc collector-emitter voltage 50 v clamp diode reverse voltage (2) 50 v v i input voltage (2) 30 v peak collector current, see figure 4 and figure 5 500 ma i ok output clamp current 500 ma total emitter-terminal current ? 2.5 a t a operating free-air temperature range uln200xa ? 20 70 c uln200xai ? 40 105 ulq200xa ? 40 85 ulq200xat ? 40 105 t j operating virtual junction temperature 150 c lead temperature for 1.6 mm (1/16 inch) from case for 10 seconds 260 c t stg storage temperature ? 65 150 c (1) jedec document jep155 states that 500-v hbm allows safe manufacturing with a standard esd control process. (2) jedec document jep157 states that 250-v cdm allows safe manufacturing with a standard esd control process. 6.2 esd ratings value unit v (esd) electrostatic discharge human body model (hbm), per ansi/esda/jedec js-001 (1) 2000 v charged device model (cdm), per jedec specification jesd22-c101 (2) 500 6.3 recommended operating conditions over operating free-air temperature range (unless otherwise noted) min max unit v cc collector-emitter voltage (non-v devices) 0 50 v t j junction temperature ? 40 125 c (1) for more information about traditional and new thermal metrics, see the semiconductor and ic package thermal metrics application report, spra953 . 6.4 thermal information thermal metric (1) ulx200x unit d (soic) n (pdip) ns (so) pw (tssop) 16 pins 16 pins 16 pins 16 pins r ja junction-to-ambient thermal resistance 73 67 64 108 c/w r jc(top) junction-to-case (top) thermal resistance 36 54 n/a 33.6 c/w r jb junction-to-board thermal resistance n/a n/a n/a 51.9 c/w jt junction-to-top characterization parameter n/a n/a n/a 2.1 c/w jb junction-to-board characterization parameter n/a n/a n/a 51.4 c/w
5 uln2002a , uln2003a , uln2003ai ulq2003a , uln2004a , ulq2004a www.ti.com slrs027o ? december 1976 ? revised january 2016 product folder links: uln2002a uln2003a uln2003ai ulq2003a uln2004a ulq2004a submit documentation feedback copyright ? 1976 ? 2016, texas instruments incorporated 6.5 electrical characteristics: uln2002a t a = 25 c parameter test figure test conditions uln2002a unit min typ max v i(on) on-state input voltage figure 14 v ce = 2 v, i c = 300 ma 13 v v oh high-level output voltage after switching figure 18 v s = 50 v, i o = 300 ma v s ? 20 mv v ce(sat) collector-emitter saturation voltage figure 12 i i = 250 a, i c = 100 ma 0.9 1.1 v i i = 350 a, i c = 200 ma 1 1.3 i i = 500 a, i c = 350 ma 1.2 1.6 v f clamp forward voltage figure 15 i f = 350 ma 1.7 2 v i cex collector cutoff current figure 9 v ce = 50 v, i i = 0 50 a figure 10 v ce = 50 v, t a = 70 c i i = 0 100 v i = 6 v 500 i i(off) off-state input current figure 10 v ce = 50 v, i c = 500 a 50 65 a i i input current figure 11 v i = 17 v 0.82 1.25 ma i r clamp reverse current figure 14 v r = 50 v t a = 70 c 100 a v r = 50 v 50 c i input capacitance v i = 0, f = 1 mhz 25 pf 6.6 electrical characteristics: uln2003a and uln2004a t a = 25 c parameter test figure test conditions uln2003a uln2004a unit min typ max min typ max v i(on) on-state input voltage figure 14 v ce = 2 v i c = 125 ma 5 v i c = 200 ma 2.4 6 i c = 250 ma 2.7 i c = 275 ma 7 i c = 300 ma 3 i c = 350 ma 8 v oh high-level output voltage after switching figure 18 v s = 50 v, i o = 300 ma v s ? 20 v s ? 20 mv v ce(sat) collector-emitter saturation voltage figure 13 i i = 250 a, i c = 100 ma 0.9 1.1 0.9 1.1 v i i = 350 a, i c = 200 ma 1 1.3 1 1.3 i i = 500 a, i c = 350 ma 1.2 1.6 1.2 1.6 i cex collector cutoff current figure 9 v ce = 50 v, i i = 0 50 50 a figure 10 v ce = 50 v, t a = 70 c i i = 0 100 100 v i = 6 v 500 v f clamp forward voltage figure 16 i f = 350 ma 1.7 2 1.7 2 v i i(off) off-state input current figure 11 v ce = 50 v, t a = 70 c, i c = 500 a 50 65 50 65 a i i input current figure 12 v i = 3.85 v 0.93 1.35 ma v i = 5 v 0.35 0.5 v i = 12 v 1 1.45 i r clamp reverse current figure 15 v r = 50 v 50 50 a v r = 50 v t a = 70 c 100 100 c i input capacitance v i = 0, f = 1 mhz 15 25 15 25 pf
6 uln2002a , uln2003a , uln2003ai ulq2003a , uln2004a , ulq2004a slrs027o ? december 1976 ? revised january 2016 www.ti.com product folder links: uln2002a uln2003a uln2003ai ulq2003a uln2004a ulq2004a submit documentation feedback copyright ? 1976 ? 2016, texas instruments incorporated 6.7 electrical characteristics: uln2003ai t a = 25 c parameter test figure test conditions uln2003ai unit min typ max v i(on) on-state input voltage figure 14 v ce = 2 v i c = 200 ma 2.4 v i c = 250 ma 2.7 i c = 300 ma 3 v oh high-level output voltage after switching figure 18 v s = 50 v, i o = 300 ma v s ? 50 mv v ce(sat) collector-emitter saturation voltage figure 13 i i = 250 a, i c = 100 ma 0.9 1.1 v i i = 350 a, i c = 200 ma 1 1.3 i i = 500 a, i c = 350 ma 1.2 1.6 i cex collector cutoff current figure 9 v ce = 50 v, i i = 0 50 a v f clamp forward voltage figure 16 i f = 350 ma 1.7 2 v i i(off) off-state input current figure 11 v ce = 50 v, i c = 500 a 50 65 a i i input current figure 12 v i = 3.85 v 0.93 1.35 ma i r clamp reverse current figure 15 v r = 50 v 50 a c i input capacitance v i = 0, f = 1 mhz 15 25 pf 6.8 electrical characteristics: uln2003ai t a = ? 40 c to 105 c parameter test figure test conditions uln2003ai unit min typ max v i(on) on-state input voltage figure 14 v ce = 2 v i c = 200 ma 2.7 v i c = 250 ma 2.9 i c = 300 ma 3 v oh high-level output voltage after switching figure 18 v s = 50 v, i o = 300 ma v s ? 50 mv v ce(sat) collector-emitter saturation voltage figure 13 i i = 250 a, i c = 100 ma 0.9 1.2 v i i = 350 a, i c = 200 ma 1 1.4 i i = 500 a, i c = 350 ma 1.2 1.7 i cex collector cutoff current figure 9 v ce = 50 v, i i = 0 100 a v f clamp forward voltage figure 16 i f = 350 ma 1.7 2.2 v i i(off) off-state input current figure 11 v ce = 50 v, i c = 500 a 30 65 a i i input current figure 12 v i = 3.85 v 0.93 1.35 ma i r clamp reverse current figure 15 v r = 50 v 100 a c i input capacitance v i = 0, f = 1 mhz 15 25 pf
7 uln2002a , uln2003a , uln2003ai ulq2003a , uln2004a , ulq2004a www.ti.com slrs027o ? december 1976 ? revised january 2016 product folder links: uln2002a uln2003a uln2003ai ulq2003a uln2004a ulq2004a submit documentation feedback copyright ? 1976 ? 2016, texas instruments incorporated 6.9 electrical characteristics: ulq2003a and ulq2004a over recommended operating conditions (unless otherwise noted) parameter test figure test conditions ulq2003a ulq2004a unit min typ max min typ max v i(on) on-state input voltage figure 14 v ce = 2 v i c = 125 ma 5 v i c = 200 ma 2.7 6 i c = 250 ma 2.9 i c = 275 ma 7 i c = 300 ma 3 i c = 350 ma 8 v oh high-level output voltage after switching figure 18 v s = 50 v, i o = 300 ma v s ? 50 v s ? 50 mv v ce(sat) collector-emitter saturation voltage figure 13 i i = 250 a, i c = 100 ma 0.9 1.2 0.9 1.1 v i i = 350 a, i c = 200 ma 1 1.4 1 1.3 i i = 500 a, i c = 350 ma 1.2 1.7 1.2 1.6 i cex collector cutoff current figure 9 v ce = 50 v, i i = 0 100 50 a figure 10 v ce = 50 v, t a = 70 c i i = 0 100 v i = 6 v 500 v f clamp forward voltage figure 16 i f = 350 ma 1.7 2.3 1.7 2 v i i(off) off-state input current figure 11 v ce = 50 v, t a = 70 c, i c = 500 a 65 50 65 a i i input current figure 12 v i = 3.85 v 0.93 1.35 ma v i = 5 v 0.35 0.5 v i = 12 v 1 1.45 i r clamp reverse current figure 15 v r = 50 v t a = 25 c 100 50 a v r = 50 v 100 100 c i input capacitance v i = 0, f = 1 mhz 15 25 15 25 pf 6.10 switching characteristics: uln2002a, uln2003a, uln2004a t a = 25 c parameter test conditions uln2002a, uln2003a, uln2004a unit min typ max t plh propagation delay time, low- to high-level output see figure 17 0.25 1 s t phl propagation delay time, high- to low-level output see figure 17 0.25 1 s 6.11 switching characteristics: uln2003ai t a = 25 c parameter test conditions uln2003ai unit min typ max t plh propagation delay time, low- to high-level output see figure 17 0.25 1 s t phl propagation delay time, high- to low-level output see figure 17 0.25 1 s
8 uln2002a , uln2003a , uln2003ai ulq2003a , uln2004a , ulq2004a slrs027o ? december 1976 ? revised january 2016 www.ti.com product folder links: uln2002a uln2003a uln2003ai ulq2003a uln2004a ulq2004a submit documentation feedback copyright ? 1976 ? 2016, texas instruments incorporated 6.12 switching characteristics: uln2003ai t a = ? 40 c to 105 c parameter test conditions uln2003ai unit min typ max t plh propagation delay time, low- to high-level output see figure 17 1 10 s t phl propagation delay time, high- to low-level output see figure 17 1 10 s 6.13 switching characteristics: ulq2003a, ulq2004a over recommended operating conditions (unless otherwise noted) parameter test conditions ulq2003a, ulq2004a unit min typ max t plh propagation delay time, low- to high-level output see figure 17 1 10 s t phl propagation delay time, high- to low-level output see figure 17 1 10 s 6.14 typical characteristics figure 1. collector-emitter saturation voltage vs collector current (one darlington) figure 2. collector-emitter saturation voltage vs total collector current (two darlingtons in parallel) 2 1.5 1 0.5 700 600 500 400 300 200 100 0 800 2.5 i c(tot) - total collector current - ma 0 vce(sat) - collector-emitter saturation voltage - v v ce(sat) i i = 250 a i i = 350 a i i = 500 a t a = 25 c 0 i c - collector current - ma 2.5 800 0 100 200 300 400 500 600 700 0.5 1 1.5 2 i i = 350 a i i = 500 a vce(sat) - collector-emitter saturation voltage - v v ce(sat) t a = 25 c i i = 250 a
9 uln2002a , uln2003a , uln2003ai ulq2003a , uln2004a , ulq2004a www.ti.com slrs027o ? december 1976 ? revised january 2016 product folder links: uln2002a uln2003a uln2003ai ulq2003a uln2004a ulq2004a submit documentation feedback copyright ? 1976 ? 2016, texas instruments incorporated typical characteristics (continued) figure 3. collector current vs input current figure 4. d package maximum collector current vs duty cycle figure 5. n package maximum collector current vs duty cycle figure 6. maximum and typical input current vs input voltage figure 7. maximum and typical saturated v ce vs output current figure 8. minimum output current vs input current 0 i i - input current - a 500 200 0 25 50 75 100 125 150 175 50 100 150 200 250 300 350 400 450 v s = 10 v v s = 8 v ic - collector current - ma c i r l = 10 t a = 25 c 0 200 400 600 800 1000 1200 1400 1600 1800 2000 2 2.5 3 3.5 4 4.5 5 input voltage C v input current ? a t j = -40c to 105c maximum typical 0 duty cycle - % 600 100 0 10 20 30 40 50 60 70 80 90 100 200 300 400 500 t a = 70 c n = number of outputs conducting simultaneously n = 6 n = 7 n = 5 n = 3 n = 2 n = 1 ic - maximum collector current - ma c i n = 4 100 150 200 250 300 350 400 450 500 250 350 450 550 650 input current C a output current C ma v ce = 2 v t j = -40c to 105c minimum conducting simultaneously n = number of outputs 500 400 300 200 100 90 80 70 60 50 40 30 20 10 0 100 600 duty cycle - % 0 n = 7 t a = 85 c n = 5 n = 3 n = 2 n = 6 n = 1 ic - maximum collector current - ma c i n = 4 0.9 1.1 1.3 1.5 1.7 1.9 2.1 100 200 300 400 500 output current C ma maximum v ce(sat) voltage ? v t j = -40c to 105c maximum typical
10 uln2002a , uln2003a , uln2003ai ulq2003a , uln2004a , ulq2004a slrs027o ? december 1976 ? revised january 2016 www.ti.com product folder links: uln2002a uln2003a uln2003ai ulq2003a uln2004a ulq2004a submit documentation feedback copyright ? 1976 ? 2016, texas instruments incorporated 7 parameter measurement information figure 9. i cex test circuit figure 10. i cex test circuit figure 11. i i(off) test circuit figure 12. i i test circuit i i is fixed for measuring v ce(sat) , variable for measuring h fe . figure 13. h fe , v ce(sat) test circuit figure 14. v i(on) test circuit open v ce i c i i h fe = i c i i open v ce v i i cex open v ce open i cex open open i i(on) v i open v ce i c i i(off) open v ce i c v i(on)
11 uln2002a , uln2003a , uln2003ai ulq2003a , uln2004a , ulq2004a www.ti.com slrs027o ? december 1976 ? revised january 2016 product folder links: uln2002a uln2003a uln2003ai ulq2003a uln2004a ulq2004a submit documentation feedback copyright ? 1976 ? 2016, texas instruments incorporated parameter measurement information (continued) figure 15. i r test circuit figure 16. v f test circuit figure 17. propagation delay-time waveforms the pulse generator has the following characteristics: prr = 12.5 khz, z o = 50 ? . c l includes probe and jig capacitance. for testing the uln2003a device, uln2003ai device, and ulq2003a devices, v ih = 3 v; for the uln2002a device, v ih = 13 v; for the uln2004a and the ulq2004a devices, v ih = 8 v. figure 18. latch-up test circuit and voltage waveforms 90% 90% 1.5 v 1.5 v 10% 10% 40 s 10 ns 5 ns v ih (see note c) 0 v v oh v ol input output voltage waveforms 200 w i f v f open v r open i r
12 uln2002a , uln2003a , uln2003ai ulq2003a , uln2004a , ulq2004a slrs027o ? december 1976 ? revised january 2016 www.ti.com product folder links: uln2002a uln2003a uln2003ai ulq2003a uln2004a ulq2004a submit documentation feedback copyright ? 1976 ? 2016, texas instruments incorporated 8 detailed description 8.1 overview this standard device has proven ubiquity and versatility across a wide range of applications. this is due to integration of 7 darlington transistors of the device that are capable of sinking up to 500 ma and wide gpio range capability. the uln2003a device comprises seven high-voltage, high-current npn darlington transistor pairs. all units feature a common emitter and open collector outputs. to maximize their effectiveness, these units contain suppression diodes for inductive loads. the uln2003a device has a series base resistor to each darlington pair, thus allowing operation directly with ttl or cmos operating at supply voltages of 5 v or 3.3 v. the uln2003a device offers solutions to a great many interface needs, including solenoids, relays, lamps, small motors, and leds. applications requiring sink currents beyond the capability of a single output may be accommodated by paralleling the outputs. this device can operate over a wide temperature range ( ? 40 c to 105 c). 8.2 functional block diagrams all resistor values shown are nominal. the collector-emitter diode is a parasitic structure and should not be used to conduct current. if the collectors go below gnd, an external schottky diode should be added to clamp negative undershoots. figure 19. uln2002a block diagram figure 20. uln2003a, ulq2003a and uln2003ai block diagram figure 21. uln2004a and lq2004a block diagram com output c e input b r b 10.5 n? 7.2 n? 3 n? com output c e input b 10.5 n? 7.2 n? 3 n? 7 v com output c e input b r b 2.7 n? 7.2 n? 3 n?
13 uln2002a , uln2003a , uln2003ai ulq2003a , uln2004a , ulq2004a www.ti.com slrs027o ? december 1976 ? revised january 2016 product folder links: uln2002a uln2003a uln2003ai ulq2003a uln2004a ulq2004a submit documentation feedback copyright ? 1976 ? 2016, texas instruments incorporated 8.3 feature description each channel of the uln2003a device consists of darlington connected npn transistors. this connection creates the effect of a single transistor with a very high-current gain ( 2). this can be as high as 10,000 a/a at certain currents. the very high allows for high-output current drive with a very low input current, essentially equating to operation with low gpio voltages. the gpio voltage is converted to base current through the 2.7-k resistor connected between the input and base of the predriver darlington npn. the 7.2-k and 3-k resistors connected between the base and emitter of each respective npn act as pulldowns and suppress the amount of leakage that may occur from the input. the diodes connected between the output and com pin is used to suppress the kick-back voltage from an inductive load that is excited when the npn drivers are turned off (stop sinking) and the stored energy in the coils causes a reverse current to flow into the coil supply through the kick-back diode. in normal operation the diodes on base and collector pins to emitter will be reversed biased. if these diodes are forward biased, internal parasitic npn transistors will draw (a nearly equal) current from other (nearby) device pins. 8.4 device functional modes 8.4.1 inductive load drive when the com pin is tied to the coil supply voltage, uln2003a device is able to drive inductive loads and suppress the kick-back voltage through the internal free-wheeling diodes. 8.4.2 resistive load drive when driving a resistive load, a pullup resistor is needed in order for uln2003a device to sink current and for there to be a logic high level. the com pin can be left floating for these applications.
14 uln2002a , uln2003a , uln2003ai ulq2003a , uln2004a , ulq2004a slrs027o ? december 1976 ? revised january 2016 www.ti.com product folder links: uln2002a uln2003a uln2003ai ulq2003a uln2004a ulq2004a submit documentation feedback copyright ? 1976 ? 2016, texas instruments incorporated 9 application and implementation note information in the following applications sections is not part of the ti component specification, and ti does not warrant its accuracy or completeness. ti ? s customers are responsible for determining suitability of components for their purposes. customers should validate and test their design implementation to confirm system functionality. 9.1 application information typically, the uln2003a device drives a high-voltage or high-current (or both) peripheral from an mcu or logic device that cannot tolerate these conditions. this design is a common application of uln2003a device, driving inductive loads. this includes motors, solenoids and relays. figure 22 shows a model for each load type. 9.2 typical application figure 22. uln2003a device as inductive load driver 9.2.1 design requirements for this design example, use the parameters listed in table 1 as the input parameters. table 1. design parameters design parameter example value gpio voltage 3.3 v or 5 v coil supply voltage 12 v to 48 v number of channels 7 output current (r coil ) 20 ma to 300 ma per channel duty cycle 100% in1 in2 uln2003a in3 in4 out1 out2 out3 out4 in5 in6 in7 gnd out5 out6 out7 com 3.3-v logic 3.3-v logic 3.3-v logic v sup v sup
15 uln2002a , uln2003a , uln2003ai ulq2003a , uln2004a , ulq2004a www.ti.com slrs027o ? december 1976 ? revised january 2016 product folder links: uln2002a uln2003a uln2003ai ulq2003a uln2004a ulq2004a submit documentation feedback copyright ? 1976 ? 2016, texas instruments incorporated 9.2.2 detailed design procedure when using uln2003a device in a coil driving application, determine the following: ? input voltage range ? temperature range ? output and drive current ? power dissipation 9.2.2.1 drive current the coil voltage (v sup ), coil resistance (r coil ), and low-level output voltage (v ce(sat) or v ol ) determine the coil current. i coil = (v sup ? v ce(sat) ) / r coil (1) 9.2.2.2 low-level output voltage the low-level output voltage (v ol ) is the same as v ce(sat) and can be determined by, figure 1 , figure 2 , or figure 7 . 9.2.2.3 power dissipation and temperature the number of coils driven is dependent on the coil current and on-chip power dissipation. the number of coils driven can be determined by figure 4 or figure 5 . for a more accurate determination of number of coils possible, use the below equation to calculate uln2003a device on-chip power dissipation p d : where ? n is the number of channels active together ? v oli is the out i pin voltage for the load current i li . this is the same as v ce(sat) (2) to ensure reliability of uln2003a device and the system, the on-chip power dissipation must be lower that or equal to the maximum allowable power dissipation (pd (max) ) dictated by below equation equation 3 . where ? t j(max) is the target maximum junction temperature ? t a is the operating ambient temperature ? r ja is the package junction to ambient thermal resistance (3) limit the die junction temperature of the uln2003a device to less than 125 c. the ic junction temperature is directly proportional to the on-chip power dissipation. ( ) j(max) a (max) ja t t pd - = q n d oli li i 1 p v i = = ?
16 uln2002a , uln2003a , uln2003ai ulq2003a , uln2004a , ulq2004a slrs027o ? december 1976 ? revised january 2016 www.ti.com product folder links: uln2002a uln2003a uln2003ai ulq2003a uln2004a ulq2004a submit documentation feedback copyright ? 1976 ? 2016, texas instruments incorporated 9.2.3 application curves the characterization data shown in figure 23 and figure 24 were generated using the uln2003a device driving an omron g5nb relay and under the following conditions: v in = 5 v, v sup = 12 v, and r coil = 2.8 k . figure 23. output response with activation of coil (turnon) figure 24. output response with de-activation of coil (turnoff) time (s) output voltage - v -0.004 0 0.004 0.008 0.012 0.016 0 1 2 3 4 5 6 7 8 9 10 11 12 13 d001 time (s) output voltage - v -0.004 0 0.004 0.008 0.012 0.016 0 2 4 6 8 10 12 14 d001
17 uln2002a , uln2003a , uln2003ai ulq2003a , uln2004a , ulq2004a www.ti.com slrs027o ? december 1976 ? revised january 2016 product folder links: uln2002a uln2003a uln2003ai ulq2003a uln2004a ulq2004a submit documentation feedback copyright ? 1976 ? 2016, texas instruments incorporated 9.3 system examples figure 25. p-mos to load figure 26. ttl to load figure 27. buffer for higher current loads figure 28. use of pullup resistors to increase drive current ulq2003a lam test ttl output v cc v 12 3 4 5 6 9 10 11 12 13 14 15 16 8 7 12 3 4 5 6 7 9 10 11 12 13 14 15 16 8 uln2002a p-mos output v ss v v dd v uln2004a ulq2004a 12 3 4 5 6 9 10 11 12 13 14 15 16 8 cmos output 7 v cc v r p ulq2003a 12 3 4 5 6 9 10 11 12 13 14 15 16 8 ttl output 7
18 uln2002a , uln2003a , uln2003ai ulq2003a , uln2004a , ulq2004a slrs027o ? december 1976 ? revised january 2016 www.ti.com product folder links: uln2002a uln2003a uln2003ai ulq2003a uln2004a ulq2004a submit documentation feedback copyright ? 1976 ? 2016, texas instruments incorporated 10 power supply recommendations this device does not need a power supply. however, the com pin is typically tied to the system power supply. when this is the case, it is very important to ensure that the output voltage does not heavily exceed the com pin voltage. this discrepancy heavily forward biases the fly-back diodes and causes a large current to flow into com, potentially damaging the on-chip metal or over-heating the device. 11 layout 11.1 layout guidelines thin traces can be used on the input due to the low-current logic that is typically used to drive uln2003a device. take care to separate the input channels as much as possible, as to eliminate crosstalk. ti recommends thick traces for the output to drive whatever high currents that may be needed. wire thickness can be determined by the current density of the trace material and desired drive current. because all of the channels currents return to a common emitter, it is best to size that trace width to be very wide. some applications require up to 2.5 a. 11.2 layout example figure 29. package layout 1 2 3 4 8 vcom 7 6 5 16 e 9 15 14 13 12 11 10 1b 2b 3b 4b 7b 6b 5b 1c 2c 3c 4c 7c 6c 5c gnd
19 uln2002a , uln2003a , uln2003ai ulq2003a , uln2004a , ulq2004a www.ti.com slrs027o ? december 1976 ? revised january 2016 product folder links: uln2002a uln2003a uln2003ai ulq2003a uln2004a ulq2004a submit documentation feedback copyright ? 1976 ? 2016, texas instruments incorporated 12 device and documentation support 12.1 documentation support 12.1.1 related documentation for related documentation, see the following: sn7546x darlington transistor arrays , slrs023 12.2 related links the table below lists quick access links. categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. table 2. related links parts product folder sample & buy technical documents tools & software support & community uln2002a click here click here click here click here click here uln2003a click here click here click here click here click here uln2003ai click here click here click here click here click here uln2004a click here click here click here click here click here ulq2003a click here click here click here click here click here ulq2004a click here click here click here click here click here 12.3 community resources the following links connect to ti community resources. linked contents are provided "as is" by the respective contributors. they do not constitute ti specifications and do not necessarily reflect ti's views; see ti's terms of use . ti e2e ? online community ti's engineer-to-engineer (e2e) community. created to foster collaboration among engineers. at e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. design support ti's design support quickly find helpful e2e forums along with design support tools and contact information for technical support. 12.4 trademarks e2e is a trademark of texas instruments. all other trademarks are the property of their respective owners. 12.5 electrostatic discharge caution these devices have limited built-in esd protection. the leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the mos gates. 12.6 glossary slyz022 ? ti glossary . this glossary lists and explains terms, acronyms, and definitions. 13 mechanical, packaging, and orderable information the following pages include mechanical packaging and orderable information. this information is the most current data available for the designated devices. this data is subject to change without notice and revision of this document. for browser based versions of this data sheet, refer to the left hand navigation.
package option addendum www.ti.com 26-sep-2018 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples uln2002an active pdip n 16 25 green (rohs & no sb/br) cu nipdau n / a for pkg type -20 to 70 uln2002an uln2002ane4 active pdip n 16 25 green (rohs & no sb/br) cu nipdau n / a for pkg type -20 to 70 uln2002an ULN2003AD active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -20 to 70 uln2003a ULN2003ADe4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -20 to 70 uln2003a ULN2003ADr active soic d 16 2500 green (rohs & no sb/br) cu nipdau | cu sn level-1-260c-unlim -20 to 70 uln2003a ULN2003ADre4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -20 to 70 uln2003a ULN2003ADrg3 active soic d 16 2500 green (rohs & no sb/br) cu sn level-1-260c-unlim -20 to 70 uln2003a ULN2003ADrg4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -20 to 70 uln2003a uln2003aid active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 105 uln2003ai uln2003aide4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 105 uln2003ai uln2003aidg4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 105 uln2003ai uln2003aidr active soic d 16 2500 green (rohs & no sb/br) cu nipdau | cu sn level-1-260c-unlim -40 to 105 uln2003ai uln2003aidre4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 105 uln2003ai uln2003aidrg4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 105 uln2003ai uln2003ain active pdip n 16 25 green (rohs & no sb/br) cu nipdau | cu sn n / a for pkg type -40 to 105 uln2003ain uln2003aine4 active pdip n 16 25 green (rohs & no sb/br) cu nipdau n / a for pkg type -40 to 105 uln2003ain uln2003ainsr active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 105 uln2003ai
package option addendum www.ti.com 26-sep-2018 addendum-page 2 orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples uln2003aipw active tssop pw 16 90 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 105 un2003ai uln2003aipwr active tssop pw 16 2000 green (rohs & no sb/br) cu nipdau | cu sn level-1-260c-unlim -40 to 105 un2003ai uln2003aipwrg4 active tssop pw 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 105 un2003ai uln2003an active pdip n 16 25 green (rohs & no sb/br) cu nipdau | cu sn n / a for pkg type -20 to 70 uln2003an uln2003ane4 active pdip n 16 25 green (rohs & no sb/br) cu nipdau n / a for pkg type -20 to 70 uln2003an uln2003ans active so ns 16 50 green (rohs & no sb/br) cu nipdau level-1-260c-unlim uln2003a uln2003ansr active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -20 to 70 uln2003a uln2003ansre4 active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -20 to 70 uln2003a uln2003ansrg4 active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -20 to 70 uln2003a uln2003apw active tssop pw 16 90 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -20 to 70 un2003a uln2003apwg4 active tssop pw 16 90 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -20 to 70 un2003a uln2003apwr active tssop pw 16 2000 green (rohs & no sb/br) cu nipdau | cu sn level-1-260c-unlim -20 to 70 un2003a uln2003apwrg4 active tssop pw 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -20 to 70 un2003a uln2004ad active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -20 to 70 uln2004a uln2004ade4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -20 to 70 uln2004a uln2004adg4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -20 to 70 uln2004a uln2004adr active soic d 16 2500 green (rohs & no sb/br) cu nipdau | cu sn level-1-260c-unlim -20 to 70 uln2004a uln2004adre4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -20 to 70 uln2004a
package option addendum www.ti.com 26-sep-2018 addendum-page 3 orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples uln2004adrg4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -20 to 70 uln2004a uln2004an active pdip n 16 25 green (rohs & no sb/br) cu nipdau n / a for pkg type -20 to 70 uln2004an uln2004ane4 active pdip n 16 25 green (rohs & no sb/br) cu nipdau n / a for pkg type -20 to 70 uln2004an uln2004ansr active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -20 to 70 uln2004a ulq2003ad active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 ulq2003a ulq2003adg4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim ulq2003a ulq2003adr active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 ulq2003a ulq2003adrg4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim ulq2003a ulq2003an active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type -40 to 85 ulq2003a ulq2004ad active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 ulq2004a ulq2004adg4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim ulq2004a ulq2004adr active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim -40 to 85 ulq2004a ulq2004adrg4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim ulq2004a ulq2004an active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type -40 to 85 ulq2004an (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device.
package option addendum www.ti.com 26-sep-2018 addendum-page 4 (2) rohs: ti defines "rohs" to mean semiconductor products that are compliant with the current eu rohs requirements for all 10 rohs substances, including the requirement that rohs substance do not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, "rohs" products are suitable for use in specified lead-free processes. ti may reference these types of products as "pb-free". rohs exempt: ti defines "rohs exempt" to mean products that contain lead but are compliant with eu rohs pursuant to a specific eu rohs exemption. green: ti defines "green" to mean the content of chlorine (cl) and bromine (br) based flame retardants meet js709b low halogen requirements of <=1000ppm threshold. antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. other qualified versions of ulq2003a, ulq2004a : ? automotive: ulq2003a-q1 , ulq2004a-q1 note: qualified version definitions: ? automotive - q100 devices qualified for high-reliability automotive applications targeting zero defects
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant ULN2003ADr soic d 16 2500 330.0 16.8 6.5 10.3 2.1 8.0 16.0 q1 ULN2003ADr soic d 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 q1 ULN2003ADr soic d 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 q1 ULN2003ADrg3 soic d 16 2500 330.0 16.8 6.5 10.3 2.1 8.0 16.0 q1 ULN2003ADrg4 soic d 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 q1 uln2003aidr soic d 16 2500 330.0 16.8 6.5 10.3 2.1 8.0 16.0 q1 uln2003aidr soic d 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 q1 uln2003aidrg4 soic d 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 q1 uln2003aipwr tssop pw 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 q1 uln2003aipwr tssop pw 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 q1 uln2003aipwrg4 tssop pw 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 q1 uln2003apwr tssop pw 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 q1 uln2003apwr tssop pw 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 q1 uln2003apwrg4 tssop pw 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 q1 uln2004adr soic d 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 q1 uln2004adr soic d 16 2500 330.0 16.8 6.5 10.3 2.1 8.0 16.0 q1 uln2004adr soic d 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 q1 uln2004adrg4 soic d 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 q1 package materials information www.ti.com 6-sep-2018 pack materials-page 1
device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant uln2004adrg4 soic d 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 q1 ulq2003adr soic d 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 q1 ulq2003adrg4 soic d 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 q1 *all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) ULN2003ADr soic d 16 2500 364.0 364.0 27.0 ULN2003ADr soic d 16 2500 367.0 367.0 38.0 ULN2003ADr soic d 16 2500 333.2 345.9 28.6 ULN2003ADrg3 soic d 16 2500 364.0 364.0 27.0 ULN2003ADrg4 soic d 16 2500 333.2 345.9 28.6 uln2003aidr soic d 16 2500 364.0 364.0 27.0 uln2003aidr soic d 16 2500 333.2 345.9 28.6 uln2003aidrg4 soic d 16 2500 333.2 345.9 28.6 uln2003aipwr tssop pw 16 2000 364.0 364.0 27.0 uln2003aipwr tssop pw 16 2000 367.0 367.0 35.0 uln2003aipwrg4 tssop pw 16 2000 367.0 367.0 35.0 uln2003apwr tssop pw 16 2000 364.0 364.0 27.0 uln2003apwr tssop pw 16 2000 367.0 367.0 35.0 uln2003apwrg4 tssop pw 16 2000 367.0 367.0 35.0 package materials information www.ti.com 6-sep-2018 pack materials-page 2
device package type package drawing pins spq length (mm) width (mm) height (mm) uln2004adr soic d 16 2500 333.2 345.9 28.6 uln2004adr soic d 16 2500 364.0 364.0 27.0 uln2004adr soic d 16 2500 367.0 367.0 38.0 uln2004adrg4 soic d 16 2500 367.0 367.0 38.0 uln2004adrg4 soic d 16 2500 333.2 345.9 28.6 ulq2003adr soic d 16 2500 333.2 345.9 28.6 ulq2003adrg4 soic d 16 2500 367.0 367.0 38.0 package materials information www.ti.com 6-sep-2018 pack materials-page 3

www.ti.com package outline c 14x 0.65 2x 4.55 16x 0.30 0.19 typ 6.6 6.2 1.2 max 0.15 0.05 0.25 gage plane -8 0 b note 4 4.5 4.3 a note 3 5.1 4.9 0.75 0.50 (0.15) typ tssop - 1.2 mm max height pw0016a small outline package 4220204/a 02/2017 1 8 9 16 0.1 c a b pin 1 index area see detail a 0.1 c notes: 1. all linear dimensions are in millimeters. any dimensions in parenthesis are for reference only. dimensioning and tolerancing per asme y14.5m. 2. this drawing is subject to change without notice. 3. this dimension does not include mold flash, protrusions, or gate burrs. mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. this dimension does not include interlead flash. interlead flash shall not exceed 0.25 mm per side. 5. reference jedec registration mo-153. seating plane a 20 detail a typical scale 2.500
www.ti.com example board layout 0.05 max all around 0.05 min all around 16x (1.5) 16x (0.45) 14x (0.65) (5.8) (r0.05) typ tssop - 1.2 mm max height pw0016a small outline package 4220204/a 02/2017 notes: (continued) 6. publication ipc-7351 may have alternate designs. 7. solder mask tolerances between and around signal pads can vary based on board fabrication site. land pattern example exposed metal shown scale: 10x symm symm 1 8 9 16 15.000 metal solder mask opening metal under solder mask solder mask opening exposed metal exposed metal solder mask details non-solder mask defined (preferred) solder mask defined
www.ti.com example stencil design 16x (1.5) 16x (0.45) 14x (0.65) (5.8) (r0.05) typ tssop - 1.2 mm max height pw0016a small outline package 4220204/a 02/2017 notes: (continued) 8. laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. ipc-7525 may have alternate design recommendations. 9. board assembly site may have different recommendations for stencil design. solder paste example based on 0.125 mm thick stencil scale: 10x symm symm 1 8 9 16

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